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B3B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-137-02-xxx-DV-BE-LC, 37 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 43045-2021 (alternative finishes: 43045-222x), 11 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, external M3, height 9, Wuerth electronics 9774040951 (https://katalog.we-online.de/em/datasheet/9774040951.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, SM06B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-124-02-xxx-DV-BE-LC, 24 Pins (http://www.molex.com/pdm_docs/sd/555600207_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-143-02-xx-DV-TE, 43 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator JST ZE series connector, B15B-EH-A (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-106-02-xxx-DV-A, 6 Pins (http://www.molex.com/pdm_docs/sd/903250004_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LGA 24L 3x3.5mm Pitch 0.43mm LGA 28 5.2x3.8mm Pitch 0.5mm LFCSP, 8 Pin (https://media.digikey.com/pdf/Data%20Sheets/Rohm%20PDFs/BD9G341EFJ.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 56 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00002142A.pdf#page=40), generated with kicad-footprint-generator ipc_noLead_generator.py 8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with missing pin 7 removed (Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline 7,5mm long https://toshiba.semicon-storage.com/info/docget.jsp?did=53548&prodName=TLP2770 6-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_32_05-08-1734.pdf DFN44 8.9x5, 0.4P; CASE 506BU-01 (see ON Semiconductor 506CE.PDF DD Package; 8-Lead Plastic Dual Flat, No Lead Package (8E) - 4x4x0.9 mm Body [VDFN] (see Microchip Packaging Specification 00000049BS.pdf DFN, 6 Pin (https://www.diodes.com/assets/Package-Files/U-DFN2018-6.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 4 times 2 mm² wires, basic insulation, conductor diameter 0.9mm, length 10.0mm, width 2.4mm solder Pin_ with flat with hole, hole diameter 1.3mm, wire diameter 1.0mm low profile wire loop as test point, loop diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00023_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO.

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