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4.8x6.4mm Body, 1.60mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/ACS780-Datasheet.ashx Allegro Microsystems SIP-3, 1.27mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/A1369-Datasheet.ashx Allegro Microsystems SIP-4, 1.27mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/A1369-Datasheet.ashx Allegro Microsystems SIP-3, 1.27mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/A1363-Datasheet.ashx Diodes SIP-3 Ammo Pack, 2.65mm Pitch (https://www.diodes.com/assets/Package-Files/SIP-3-Ammo-Pack.pdf Diodes SIP-3 Ammo Pack Miniature Wired Open-Loop Current Sensor LEM CKSR 6/15/25/50/75-NP Current Transducer, https://www.lem.com/sites/default/files/products_datasheets/cksr_75-np.pdf LEM HO 8/15/25-NP Current Transducer (https://www.lem.com/sites/default/files/products_datasheets/la_25-p.pdf LEM current transducer (https://www.lem.com/sites/default/files/products_datasheets/hx%205_15-np_e%20v10.pdf LEM HX05-P-SP2 hall effect current transducer (https://www.lem.com/sites/default/files/products_datasheets/hx%203_50-p_sp2_e%20v07.pdf LEM HX06-P hall effect current transducer (https://www.lem.com/sites/default/files/products_datasheets/hx%203_50-p_sp2_e%20v07.pdf LEM HX06-P hall effect current transducer (https://www.lem.com/sites/default/files/products_datasheets/hx%203_50-p_sp2_e%20v07.pdf LEM HX04-P hall effect current transducer (https://www.lem.com/sites/default/files/products_datasheets/hx%203_50-p_sp2_e%20v07.pdf LEM HX25-P-SP2 hall effect current transducer LEM_LTSR-NP 5V supply voltage series https://www.lem.com/sites/default/files/products_datasheets/ltsr_6-np.pdf DFN, 4 Pin (https://toshiba.semicon-storage.com/info/docget.jsp?did=12884&prodName=TLP291), generated with kicad-footprint-generator JST XA series connector, DF3EA-09P-2H (https://www.hirose.com/product/document?clcode=CL0543-0332-0-51&productname=DF3EA-5P-2H(51)&series=DF3&documenttype=2DDrawing&lang=en&documentid=0001163317), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP, 24 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation DB), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 40 Pin (JEDEC MO-153 Var JB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 24 Pin (https://www.nxp.com/docs/en/package-information/SOT616-3.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0530, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 44 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/2512S.pdf#page=17), generated with kicad-footprint-generator ipc_gullwing_generator.py SSOP24: plastic shrink small outline package; 16 leads; body width 16.90 mm Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size 6.7x11.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 12x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD DIP Switch SPST Slide 8.9mm 350mil SMD 2x-dip-switch SPST Copal_CHS-02B, Slide, row spacing 15.24 mm (600 mils), LongPads 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 4x-dip-switch SPST Copal_CHS-04B, Slide, row spacing 26.67 mm (1050 mils), SMDSocket, SmallPads 6-lead though-hole mounted high-volatge DIP package (based on http://www.latticesemi.com/view_document?document_id=213 BGA 0.8mm 9mm 121 BGA-132 11x17 12x18mm 1.0pitch Altera BGA-144 M144 MBGA Altera UBGA U169 BGA-169 BGA-200, 14.5x10.0mm, 200 Ball, 12x22 Layout, 0.8x0.65mm Pitch, http://www.issi.com/WW/pdf/43-46LQ32256A-AL.pdf Altera BGA-256 M256 MBGA BGA-256, dimensions: https://www.xilinx.com/support/documentation/package_specs/ft256.pdf, design rules: https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf Altera UBGA U324 BGA-324 BGA-624, 25x25 grid, 21x21mm package, pitch 0.65mm UFBGA-32, 6x6, 4x4mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UCBGA-49, 7x7 raster, 3x3mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f071v8.pdf WLCSP-63, 7x9 raster, 3.228x4.164mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103ze.pdf Lattice caBGA-381 footprint for.

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