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BackPlastic thin shrink small outline package; 14 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot369-1_po.pdf SSOP, 16 Pin (http://cds.linear.com/docs/en/datasheet/37551fd.pdf#page=23), generated with kicad-footprint-generator Soldered wire connection with feed through strain.
- 0.694966 -0.464389 -0.548968 vertex 3.10499 1.28613.
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