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WLCSP-100, off-center ball grid, ST die ID 460, 2.3x2.48mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, YFF0006, NSMD pad.

• DFN, 8 Pin (https://www.ti.com/lit/ds/symlink/lp2951-n.pdf), generated with.
• Footprint could stand to be larger than.

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