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Mils 48-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 24-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 6x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 18-lead though-hole mounted DIP package, row spacing 11.48 mm (451.

• Pogo pins Tag-Connect programming header.
• 42819-52XX, With thermal vias in pads.
• 25-pin D-Sub connector, horizontal/angled (90 deg), THT-mount.
• 6.4mm no annular m6 Mounting Hole 2.2mm, M2.

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