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ST WLCSP-52, ST die ID 461, 4.63x4.15mm, 115 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, DSBGA, area grid, YZP, YZP0010.

• 3.40929 -0.719793 18.9636 vertex 5.39071 -0.719793 18.9636 vertex.
• 14-pin zero insertion force.
• Relay DPDR Pitch 5.08 AXICOM.
• 0.622319 0.280777 facet normal 0.771715.
• -2.375573e-15 -1.000000e+00 facet normal.

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