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400mil 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 32-lead dip package, row spacing 7.62 mm (300 mils 20-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils SMD DIP DIL PDIP 2.54mm 15.24mm 600mil LongPads 24-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 20-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 12-lead surface-mounted (SMD) DIP package, row spacing 6.15 mm (242 mils), body size 9.78x30.12mm.

• 6.16411 20 facet normal -0.0729619 0.338843.
• PCB Slot-milling test: Cost (incl ship), per PCB.

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