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Pads; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Shrink Small Outline (SM) - 5.28 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 20-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP SMDIP 2.54mm 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET MN MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET L6 MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET M4 MOSFET Infineon DirectFET L8 MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET SB.

• Normal 0.0731528 0.0677834 0.995015 vertex -6.47657 4.7055.
• MS2: * * * .
• Female XT60, through hole.
• Vertex 2.36512 1.4028 19.9.
• -4.539842e-001 7.790953e-001 4.323296e-001 facet.

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