Labels Milestones

Back

Via insulated copper area below body, vias included (case drawing: https://ww2.minicircuits.com/case_style/MMM168.pdf, land pattern PL-230, including GND vias (https://www.minicircuits.com/pcb/98-pl176.pdf Footprint for Mini-Circuits case TT1224 (https://ww2.minicircuits.com/case_style/TT1224.pdf) following land-pattern.

• -3.018107e-001 5.182469e-001 8.002065e-001 facet normal 0.129416 -0.645447 0.752761.
• -0.48503 -0.124395 0.865605 facet normal.

New Pull Request

0 Open 0 Closed

Label

Show archived labels

Use alt + click/enter to exclude labels

All labels No label

Milestone

All milestones No milestones

Project

All projects No project

0 Open 0 Closed

Close

Label

Clear labels

Milestone

No milestone

Projects

Clear projects