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Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 324 0.8 CS324 CSG324 BGA 324.

• C, Rect series, Radial, pin pitch=10.00mm.
• Number: 1766709 12A 630V.
• Normal 0.83125 0.555899 4.94372e-08 vertex.
• Normal 2.883916e-16 1.282986e-15 -1.000000e+00 facet normal.

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