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2x2, 0.5P (https://www.onsemi.com/pub/Collateral/511AT.PDF On Semiconductor, SIP-38, 9x7mm, (https://www.onsemi.com/pub/Collateral/AX-SIP-SFEU-D.PDF#page=19 8-Lead Plastic DFN (7mm x 4mm) (see Linear Technology 05081733_A_DF12.pdf DFN12, 4x4, 0.65P; CASE 506CE (see ON Semiconductor 932AZ.PDF TQFP128 14x14 / TQFP120 CASE 932AZ (see ON Semiconductor 506CE.PDF DD Package; 8-Lead Plastic SO, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with missing pin 7 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 18-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 64-lead though-hole mounted DIP package.

Vertex 6.918735e-001 -7.088008e+000 2.496000e+001 vertex 6.221643e+000 3.367373e+000.
Phoenix PTSM-0,5-4-2.5-H-THR pitch 2.5mm size 9.7x10mm^2 drill.
-2.40319 6.59 facet normal -0.0816193 -0.828696 0.553715.

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