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Pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=273, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=284, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=84, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row (from Kicad 4.0.7), script generated Surface mounted pin header SMD 2x23 2.54mm double row Through hole angled pin header SMD 2x31 1.27mm double row surface-mounted straight socket strip, 2x37, 1.27mm pitch, 4.0mm pin length, double rows Through hole pin header THT 2x02 1.27mm double row Through hole angled pin header THT 2x35 1.27mm double row Through hole angled pin header THT 2x11 1.00mm double row surface-mounted straight socket strip, 2x06, 2.00mm pitch, 4.2mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header THT 1x25 2.00mm.

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