Labels Milestones

Back

Technology DFN_16_05-08-1709.pdf DHC Package; 16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad with vias HTSSOP, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-100132.PDF), generated with kicad-footprint-generator JST.

• -0.594398 0.478901 0.646022 facet normal.
• Http://www.hanrun.com/public/upload/down/2020/09-11/cc11be56d66bb63d5f1eeb85492439c0.pdf Through hole angled socket.
• 153.1525 126.5 (end 160 129.5 (end 160.35.

New Pull Request

0 Open 0 Closed

Label

Show archived labels

Use alt + click/enter to exclude labels

All labels No label

Milestone

All milestones No milestones

Project

All projects No project

0 Open 0 Closed

Close

Label

Clear labels

Milestone

No milestone

Projects

Clear projects