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IHA-104 Inductor, Axial series, Axial, Vertical, pin pitch=2.54mm, , length*diameter=5.2*2.7mm^2, , https://www.diodes.com/assets/Package-Files/DO-41-Plastic.pdf Diode DO-41_SOD81 series Axial Vertical pin pitch 18.29mm diameter 27.9mm Vishay IHB-3 Inductor, Radial series, Radial, pin pitch=2.50mm, , length*width=4.6*3.0mm^2, Capacitor, http://www.wima.de/DE/WIMA_MKS_02.pdf C Rect series Radial pin pitch 10.00mm diameter 40mm Electrolytic Capacitor CP, Radial_Tantal series, Radial, pin pitch=6.60mm, , length*width=16.4*7.6mm^2, Vishay, TJ3, BigPads, http://www.vishay.com/docs/34079/tj.pdf L_Toroid Vertical series Radial pin pitch 2.50mm diameter 4.5mm Tantal Electrolytic Capacitor, , http://www.vishay.com/docs/42037/53d.pdf CP Axial series Axial Horizontal pin pitch 5.08mm size 45.7x11.2mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00244 pitch 10.2mm size 76.2x8.3mm^2 drill 1.3mm pad 2.5mm terminal block Metz Connect Type011_RT05505HBWC pitch 5mm size 80x9.8mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00297, 12 pins, pitch 5.08mm, size 35.6x11.2mm^2, drill diamater 1.4mm, pad diameter 2.6mm, see http://www.metz-connect.com/de/system/files/productfiles/Datenblatt_317031_RT10NxxHGLU_OFF-022897S.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block Metz Connect Type101_RT01606HBWC, 6 pins, dual row male, vertical entry Harwin LTek Connector, 26 pins, dual row (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_VQFN_7x7_Dual_Row_%5BSVB%5D_C04-21420a.pdf 40-Lead (32-Lead Populated) Plastic Quad Flat No-Lead Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments EUW 7 Pin Double Sided Module Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition Appendix A BGA 676 1 FF676 FFG676 FFV676 Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition Appendix A BGA 324 0.8 GateMate FPGA Maxim WLP-12, W121H2+1, 2.008x1.608mm, 12 Ball, 4x3 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf ST WLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 13x8 Layout, 0.4mm Pitch.

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