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Score caixa_sr1.png | Bin 0 -> 71984 bytes 3D Printing/Panels/MAGIC MISSILE VCF.png' f1ff8406b4 Delete '3D Printing/Panels/BLADE BARRIER.png' 3D Printing/Panels/BLADE BARRIER.png | Bin 0 -> 70804 bytes README.md | 8 pin DIP socket A-001 1 14 pin connector, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F215079%7FY1%7Fpdf%7FEnglish%7FENG_CD_215079_Y1.pdf%7F215079-4 connector TE-Connectivity Micro-MaTch Vertical 215079-8 7-215079-8 USB 3.0, type A, Horizontal, https://www.molex.com/pdm_docs/sd/676433910_sd.pdf USB_A Female Connector receptacle USB A connector https://belfuse.com/resources/drawings/stewartconnector/dr-stw-ss-52100-001.pdf USB type A, right angle, PTS645VL83-2 LFS tactile switch https://www.ckswitches.com/media/1973/ksc7.pdf C&K Switches 1P1T SMD PTS125 Series 12mm Tact Switch Low-profile SMD Tactile Switch, https://www.e-switch.com/system/asset/product_line/data_sheet/165/TL3342.pdf SWITCH SMD KSA SW 4-bit rotary coded switch, J-hook, https://www.nidec-copal-electronics.com/e/catalog/switch/sh-7000.pdf 4-bit rotary coded switch, gull wing, Gray code, https://www.nidec-copal-electronics.com/e/catalog/switch/sh-7000.pdf SMD SMT SPST EVQPUM EVQPUD SMD 1x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 40-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 64-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 8-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 1x-dip-switch SPST Copal_CHS-01B, Slide, row spacing 9.53 mm (375 mils 8-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 22-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 5-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 24-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils Analog BGA-28 4.0mm x 6.25mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l151cc.pdf WLCSP-64, 8x8 raster, 3.347x3.585mm package, pitch 0.4mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f378vc.pdf WLCSP-72, 9x9 raster, 4.4084x3.7594mm package, pitch 0.5mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf TFBGA-100, 10x10, 9x9mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf Infineon LFBGA-292, 0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=25 FBGA-78, 10.5x9.0mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=28 FBGA-96, 14.0x9.0mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00855D.pdf#page=1 TFBGA-196, 11.0x11.0mm, 196 Ball, 14x14 Layout, 0.75mm Pitch, http://ww1.microchip.com/downloads/en/DeviceDoc/SAMA5D2-Series-Data-Sheet-DS60001476C.pdf#page=2956 FBGA-78, 10.6x7.5mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf.

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