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Exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments DSBGA BGA.

• Normal 0.366288 0.925175 0.0994222.
• Normal -9.921705e-01 -4.918977e-03 -1.247936e-01 facet normal 0.302887 0.92061.

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