Labels Milestones
Back0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 20x20 grid, 17x17mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3.
- 1.384484e+000 -6.987365e+000 1.747200e+001 vertex 3.426833e-001 -7.112523e+000 9.983999e+000 vertex.
- 1.61115 19 vertex -2.67925.
- -7.35197 6.86195 facet normal -0.471711.
- 7.70201 0.0405665 facet normal.
- -1.063774e+02 9.695134e+01 1.152895e+01 facet.