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Mm Body, 2.00 mm Footprint [TQFP] thermal pad HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 4.4 mm; thermal pad LQFP, 32 Pin (https://www.ti.com/lit/ds/symlink/bq25703a.pdf#page=90), generated with kicad-footprint-generator ipc_plcc_jLead_generator.py PLCC, 84 pins, surface mount SMD Kemet EC2 signal relay DPDT double dual coil latching through hole 4.5mm.

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