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300mil LongPads 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 5-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket THT DIP DIL PDIP 2.54mm 24.13mm 950mil SMDSocket LongPads 64-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 24-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 14-lead though-hole mounted DIP package.

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