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0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf SSOP16: plastic shrink small outline package; 44 leads; body width 3.9 mm; lead pitch 0.65 mm (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 temperature sensor diode TO-92 horizontal, leads in-line, wide, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm Footprint [HTQFP] thermal pad (http://www.analog.com/media/en/technical-documentation/data-sheets/AD9852.pdf 80-Lead Plastic Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole pin header SMD 1x36 2.00mm single row Surface mounted socket strip THT 1x28 1.00mm single row Through hole angled pin header SMD 2x21 2.54mm double row surface-mounted straight socket strip, 1x34, 2.54mm pitch, single row (from Kicad 4.0.7), script generated Through hole socket strip SMD 1x38 2.54mm single row (from Kicad 4.0.7), script generated Through hole angled socket strip SMD 1x14 1.00mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole angled pin header, 2x01, 2.54mm pitch, 8.51mm socket length, single row Surface mounted pin header SMD 2x02 1.00mm double row Through hole angled socket strip THT 1x33 1.27mm single row Surface mounted socket strip SMD 2x35 2.54mm double row surface-mounted straight pin header, 1x02, 1.27mm pitch, 4.4mm socket length, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole angled pin header, 2x12, 1.27mm pitch, 4.0mm pin length, single row Through hole pin header THT 1x26 1.27mm single row style1 pin1 left Surface mounted pin header SMD 2x37 1.27mm double row Through hole angled pin header, 2x28, 1.27mm pitch, single row Surface.

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