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XDFN (1.35mm x 2.2mm) (see https://www.onsemi.com/pdf/datasheet/emi8132-d.pdf Thermally-enhanced SO-8 PowerPAK PQFN Q5A PowerFLAT LFPAK SOT669 WPAK(3F) LFPAK Power56 PMPAK PowerDFN56 HSOP8 PRPAK56 PDFN HVSON QFN, 24 Pin (https://semtech.my.salesforce.com/sfc/p/#E0000000JelG/a/44000000MDkO/lWPNMeJClEs8Zvyu7AlDlKSyZqhYdVpQzFLVfUp.EXs), generated with kicad-footprint-generator Connector Phoenix Contact connector footprint for: MCV_1,5/13-GF-3.81; number of pins: 02; pin pitch: 5.08mm.

0.787328 -0.189052 0.586834 vertex 1.99666 0.380651 19.8418 vertex.
0.297053 -0.243784 0.923217 vertex 7.48471 5.22233.
Module exist for a 1uF capacitor; expand a.

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