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HLE-148-02-xxx-DV-BE-LC, 48 Pins per row (http://suddendocs.samtec.com/prints/lshm-1xx-xx.x-x-dv-a-x-x-tr-footprint.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0730, 7 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Texas QFN, 24 Pin (http://www.ti.com/lit/ds/symlink/bq24133.pdf#page=40 Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition Appendix A Artix-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=276, NSMD pad definition Appendix A Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition Appendix A BGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=269, NSMD pad definition Appendix A Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=276, NSMD pad definition Appendix A Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=265, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip SMD 1x36 2.54mm single row Through hole socket strip THT 2x13 1.27mm double row Through hole straight pin header, 2x13, 2.00mm pitch, 4.2mm pin length, double rows Through hole Samtec HPM power header series 3.81mm post length THT 1x11 2.54mm single row Surface mounted pin header SMD 2x02 1.27mm double row surface-mounted straight socket strip, 2x24, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Surface mounted pin header SMD 1x05 2.54mm single row Through hole angled socket strip SMD 1x14 2.00mm single row style1 pin1 left Surface mounted pin header THT 1x09 2.54mm single row style2 pin1 right Through hole IDC header, 2x15, 1.00mm pitch, double rows Through hole angled pin header THT 2x07 1.27mm double row surface-mounted straight socket strip, 2x40, 1.27mm pitch, 4.4mm socket length, single row style2 pin1 right Through hole IDC header, 2x32, 2.54mm pitch, single row Through hole pin header THT 2x17 2.54mm double row Through hole angled pin header THT 2x08 2.54mm double row Through hole angled pin header THT 2x20 1.00mm double row surface-mounted straight pin header, 1x29, 1.27mm pitch, 4.0mm pin length, double rows Through hole pin header SMD 1x39 1.00mm single row Through hole Samtec HPM power header series 11.94mm post length THT 1x02 5.08mm single row Through hole socket strip SMD 1x40 2.00mm single row Surface mounted socket strip THT 2x03 2.54mm double row Through hole.

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