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Pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition Appendix A BGA 324 0.8 CS325 CSG235 Spartan-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition Appendix A BGA 1156 1 RF1157 RF1158 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=297, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=299, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole socket strip SMD 2x08 2.00mm double row surface-mounted straight pin header, 2x16, 2.54mm pitch, 8.51mm socket length, single row Through hole straight socket strip, 2x24, 2.00mm pitch, single row Through hole angled pin header SMD 1x04 2.54mm single row Through hole angled pin header SMD 1x15 2.00mm single row Through hole pin header THT 2x05 1.27mm double row Through hole angled pin header THT 1x24 2.00mm single row Through hole Samtec HPM power header series 11.94mm post length, 1x07, 5.08mm pitch, single row Through hole IDC header, 2x05, 2.54mm pitch, DIN.

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