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9x12 raster, 4.095x5.094mm package, pitch 0.5mm UFBGA-64, 8x8 raster, 4.539x4.911mm package, pitch 0.35mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition Appendix A BGA 1924 1 FL1925 FLG1925 FL1926 FLG1926 FL1928 FLG1928 FL1930 FLG1930 Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole straight pin header, 2x11, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 2x38, 1.00mm pitch, double rows Through hole socket strip SMD 2x14 1.00mm double row surface-mounted straight socket strip, 1x19, 2.54mm pitch, 8.51mm socket length, single row Surface mounted socket strip SMD 1x32 2.54mm single row Surface mounted socket strip SMD 1x37 1.27mm single row style2 pin1 right Through hole angled socket strip SMD 2x38 2.00mm double row Through hole angled pin header, 2x22, 1.00mm pitch, single row Through hole angled socket strip SMD 2x11.

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