3
1
Back

Chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Through hole angled pin header SMD 1x14 2.00mm single row style1 pin1 left Surface mounted pin header THT 1x30 1.27mm single row Through hole angled pin header, 2x17, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x35, 2.54mm pitch, single row Through hole straight pin header, 2x08, 2.54mm pitch, 8.51mm socket length, single row Through hole straight pin header, 1x30, 1.27mm pitch, single row Through hole straight Samtec HPM power header series 11.94mm post length THT 1x16 2.54mm single row (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x26, 1.27mm.

New Pull Request