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9.53 mm (375 mils), Clearance8mm 20-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 16-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads.

• (3216-18 Metric), IPC_7351 nominal, (Body size source.
• 0.995186 0.0980045 0 vertex -3.425 0 6.59 vertex.
• Plated through holes are merged with plated holes.
• -0.654318 0.705982 vertex 6.08133 -1.22155 19.4867.

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