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Size From d8deca9307af08e321f2f6168a97d7f0d7734956 Mon Sep 17 00:00:00 2001 From 1a5b794ab9bac64e7d0bb61780efe97d27a2e668 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Notes about component heights, swapping rotary and toggle .../Unseen Servant/Unseen Servant.kicad_sch | 1279 Notes on needed revisions from revision 1: Fix silkscreen misalignment for lower three knobs 4efd2875e8 Replaced accidentally dropped Fine tuning hole. Main synth_tools/Schematics/SynthMages.pretty/P160_pot_hole_nonpcb.kicad_mod 24 lines Binary files a/3D Printing/AD&D 1e spell names in Filmoscope Quentin' Delete '3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/MAGIC MOUTH.png' Delete '3D Printing/Panels/AD&D 1e spell names in Filmoscope Quentin/Panels/MAGIC MOUTH.png' Delete '3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/COLOR SPRAY.png and /dev/null differ Latest commits for branch schematic Merge pull request 'new_footprints' (#5) from new_footprints into main pull from: bugfix/v1.1 merge into: synth_mages:main Schematics/Unseen Servant/Unseen Servant.kicad_pcb Normal file View File Schematics/Unseen Servant/Unseen Servant.kicad_sch From 8fe829edc2a52299443ce1d2193e2aa04d060c17 Mon Sep 17 00:00:00 2001 Subject: [PATCH] init PSU/Synth Mages Power Word Stun.kicad_pcb group "" (id efdac9a8-63a2-4056-9007-59528f4494a3 Username Email Address Password Confirm Password CAPTCHA Already have an account? Sign in now! Main synth_tools/Schematics/SynthMages.pretty/SOCKET_3_PIN_HEADER_NORMAL.kicad_mod 45 lines C1 is too small for a single 0.75 mm² wire, basic insulation, conductor diameter 0.9mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g491re.pdf ST WLCSP-81, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100489.PDF WLCSP-25, 5x5 raster, 2.133x2.070mm package, pitch 0.5mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f303r8.pdf WLCSP-49, 7x7 raster, 3.294x3.258mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm.

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