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Body (https://www.micron.com/~/media/documents/products/technical-note/nor-flash/tn1225_land_pad_design.pdf TSOP-I, 56 Pin (http://www.cypress.com/file/416486/download#page=40), generated with kicad-footprint-generator Soldered wire connection, for 2 times 2.5 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py DD Package; 14-Lead Plastic DFN, 4mm x 3mm MLF - 3x3x0.85 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 16-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 9.78x9.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 10x-dip-switch SPST Copal_CHS-10A, Slide, row spacing 7.62 mm (300 mils), body size 10.8x21.88mm 8x-dip-switch SPST , Slide, row spacing.

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