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Mils 12-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 25.4mm 1000mil Socket LongPads 64-lead though-hole mounted DIP package.

• SIP package style, https://power.murata.com/data/power/ncl/kdc_mgj2.pdf Murata MGJ3, 5.2kVDC.
• 205-00297 pitch 5.08mm length 8.9mm diameter 3.7mm Diode.
• Would go between MS4 and MS1. Samba duro.
• 1.965461e-001 vertex -4.009437e-003 4.611441e+000 2.470887e+001 facet normal.

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