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Http://www.ti.com/lit/ml/mpds158c/mpds158c.pdf VSO40: plastic very small outline package; 18 leads; body width 3.9 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot510-1_po.pdf TSSOP, 44 Pin (JEDEC MO-153 Var GB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, old mpn/engineering number: 1-770858-x, 5 Pins per row (http://www.molex.com/pdm_docs/sd/1053141208_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 68 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator Connector Phoenix Contact connector footprint for: MCV_1,5/16-GF-3.81; number of pins: 10; pin pitch: 5.08mm; Angled || order number: 1766233 12A 630V Generic Phoenix Contact connector footprint for: MSTBVA_2,5/16-G; number of pins: 03; pin pitch: 5.00mm; Vertical || order number: 1776812 12A Generic Phoenix Contact connector footprint for: MSTB_2,5/7-GF; number of pins: 04; pin pitch: 3.81mm; Vertical; threaded.

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