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LongPads 8-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 8x-dip-switch SPST Copal_CHS-08A, Slide, row spacing 10.16 mm (400 mils), SMDSocket, LongPads 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x14.26mm 5x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 32-pin zero insertion force socket, though-hole, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 24-lead surface-mounted (SMD) DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 48-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of 10-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 18-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 9.78x4.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 5x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket 28-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 4x-dip-switch SPST , Slide, row spacing 8.89 mm (350 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 7x-dip-switch SPST , Piano, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 18-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 10-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil LongPads 5-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 3x-dip-switch SPST KingTek_DSHP03TJ, Slide, row spacing 15.24 mm (600 mils Toshiba 11-7A9 package, like 6-lead dip package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias in pads, 4 Pins (http://www.molex.com/pdm_docs/sd/559320210_sd.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, 502585-1570 (http://www.molex.com/pdm_docs/sd/5025850270_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP10: plastic thin shrink small outline package; 20 leads; body width 3 mm; (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 diode SOD70 2-pin TO-92 horizontal, leads molded, narrow, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot158-1_po.pdf VSO56: plastic very small outline package http://www.ti.com/lit/ds/symlink/drv8301.pdf HVSSOP, 10 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-10/CP_10_9.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 16 Pin (JEDEC MO-153 Var FC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Hirose DF13 through hole, DF13-03P-1.25DSA, 3 Pins per row (http://www.molex.com/pdm_docs/sd/1053091203_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with double.

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