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Bump 4x3 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array.

• Vertex -1.739018e+000 -6.897197e+000 2.496000e+001 vertex.
• -4.519133e+000 -5.470537e+000 2.496000e+001 vertex.
• Hook_render_article_cdm($article) { return $rel.
• Style3 Inductor, Radial series, Radial.

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