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Mils 4-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils THT DIP DIL PDIP 2.54mm 24.13mm 950mil SMDSocket LongPads 28-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 10-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm.

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