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SMD SMT SPST EVQPUM EVQPUD SMD 1x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 4x-dip-switch SPST Omron_A6S-410x, Slide, row spacing 7.62 mm (300 mils), body size 6.7x9.18mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 3x-dip-switch SPST Omron_A6S-310x, Slide, row spacing 7.62 mm (300 mils 20-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 8x-dip-switch SPST Copal_CVS-08xB, Slide, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 4x-dip-switch SPST Omron_A6S-410x, Slide, row spacing 11.48 mm (451 mils 10-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 24-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils 16-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 2x-dip-switch SPST Omron_A6H-2101, Slide, row spacing 9.53 mm (375 mils), Clearance8mm 12-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 2x-dip-switch SPST Copal_CHS-02A, Slide, row spacing 7.62 mm (300 mils), Socket 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 28-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 32-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf Power Integrations E Package eSIP-7F Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations variant of 8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [QFN] (see datasheet at http://www.cypress.com/file/138911/download and app note 93 (https://www.catagle.com/45-2/PDF_AN93.htm Bourns TBU-CA Fuse, 2 Pin (https://www.bourns.com/data/global/pdfs/TBU-CA.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-2105, With thermal vias in pads, 6 Pins (https://www.molex.com/pdm_docs/sd/009652028_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py VQFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=338), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 16 Pin (JEDEC MO-241/VAC, https://assets.nexperia.com/documents/package-information/SOT764-1.pdf), generated with kicad-footprint-generator JST ZE series connector, B7PS-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py TQFN, 20 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4011fb.pdf#page=24), generated with kicad-footprint-generator ipc_gullwing_generator.py MSOP, 16 Pin (https://www.st.com/resource/en/datasheet/stp08cp05.pdf#page=20), generated with kicad-footprint-generator JST PHD series.

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