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Pin (http://www.ti.com/lit/ds/symlink/msp430g2001.pdf#page=43), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 1-770969-x, 3 Pins per row, Mounting: (http://www.molex.com/pdm_docs/sd/039281043_sd.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 1-770875-x, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py MSOP, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_DFN_2x3x0_9_MC_C04-123C.pdf), generated with kicad-footprint-generator Hirose series connector, B4P-VH-B (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-142-02-xxx-DV, 42 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST SH series connector, S10B-J21DK-GGXR (http://www.jst-mfg.com/product/pdf/eng/eJFA-J2000.pdf), generated with kicad-footprint-generator Harting har-flexicon horizontal Harting har-flexicon series connector, 502386-0270 (http://www.molex.com/pdm_docs/sd/5023860270_sd.pdf), generated with kicad-footprint-generator Harwin Male Horizontal Surface Mount Package (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf Power Integrations K Package PowerPAK SO-8 Single (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72599/72599.pdf 16-Lead Plastic DFN (2mm x 3mm) (see Linear Technology 05081707_A_DHD16.pdf DH Package; 16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad with vias; (http://www.ti.com/lit/ds/symlink/drv8800.pdf HTSSOP, 16 Pin (http://www.ti.com/lit/ds/symlink/lmh0074.pdf#page=13), generated with kicad-footprint-generator Tantalum Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator ACDC-Converter, 3W, Meanwell, IRM-03, SMD, http://www.meanwell.com/webapp/product/search.aspx?prod=IRM-03 ACDC-Converter, 3W, CUI PBO-3, THT https://www.cui.com/product/resource/pbo-3.pdf Converter AC-DC THT Vertical ACDC-Converter, 3W, CUI PBO-3, THT https://www.cui.com/product/resource/pbo-3.pdf Converter AC-DC THT Vertical ACDC-Converter, 3W, CUI PBO-3, THT https://www.cui.com/product/resource/pbo-3.pdf Converter AC-DC THT Vertical ACDC-Converter, 3W, Meanwell, IRM-03, THT, https://www.meanwell.com/Upload/PDF/IRM-03/IRM-03-SPEC.PDF ACDC-Converter 5W THT HiLink board mount | | | ----- | --- | ---- | ---- | | | | | R31 | 1 | 100k | Resistor | | J3 | 1 | AudioJack2_SwitchT | Audio Jack, 2 Poles (Mono / TS *(optional) SIP socket, 2.54 mm, 1x2 (see build notes The build is pretty straightforward except for mechanical assembly, and two other things: Latest commits for file Datasheets/2N3903-Motorola.pdf # Autorouter files (exported from Eeschema *.net # Autorouter files (exported from Eeschema # Autorouter files (exported from Eeschema) *.net # Autorouter files (exported from Pcbnew *.ses # Exported BOM files *.xml *.csv # KiCad backups folders temp_* # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes are merged with plated holes count 16 Not plated through holes: ============================================================= 2bd01a1ff2d30ca3cff647bbf3b80645437cc07c Add schematic, start on PCB with on-board antenna Bluetooth Dual-mode module with integral chip antenna (http://ww1.microchip.com/downloads/en/DeviceDoc/60001380C.pdf Cypress.

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