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Https://www.quectel.com/UploadImage/Downlad/Quectel_BC95_Hardware_Design_V1.3.pdf GSM NB-IoT module BC95 Quad-Band GSM/GPRS module, 19.9x23.6x2.65mm, https://www.quectel.com/UploadImage/Downlad/M95_Hardware_Design_V1.3.pdf Quad-Band GSM/GPRS module, 24x24x3mm, http://simcom.ee/documents/SIM900/SIM900_Hardware%20Design_V2.05.pdf Telit xL865 familly footprint, http://www.telit.com/fileadmin/user_upload/products/Downloads/3G/Telit_UL865_Hardware_User_Guide_r8.pdf ublox Sara GSM/HSPA modem, https://www.u-blox.com/sites/default/files/SARA-G3-U2_SysIntegrManual_%28UBX-13000995%29.pdf, pag.162 ublox SARA-G3 SARA-U2 GSM HSPA Footprint for Mini-Circuits case GP731 (https://ww2.minicircuits.com/case_style/GP731.pdf Footprint for Mini-Circuits case HZ1198 (https://ww2.minicircuits.com/case_style/HZ1198.pdf Footprint for Mini-Circuits case QQQ130 (https://ww2.minicircuits.com/case_style/QQQ130.pdf) following land pattern drawing: https://ww2.minicircuits.com/pcb/98-pl094.pdf Footprint for the grant of the glide capacitor (C13) is connected to trigger, gate jack is normalized\nto +12 V, and sustain voltage is taken from \npot pin 1 x 1 mm, 734-141 , 11 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex SPOX Connector System, 43045-0621 (alternative finishes: 43045-020x), 1 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0694-9-81&productname=DF12C(3.0)-50DS-0.5V(81)&series=DF12&documenttype=2DDrawing⟨=en&documentid=0000994748), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 2 times 0.25 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 3.5mm, size source Multi-Contact FLEXI-xV 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator connector JST SUR series connector, SM15B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator Samtec HLE horizontal Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-106-02-xxx-DV-LC, 6 Pins per row (http://www.molex.com/pdm_docs/sd/431602102_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-147-02-xxx-DV-A, 47 Pins per row (http://www.molex.com/pdm_docs/sd/1053091203_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 64 Pin (JEDEC MO-153 Var BC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_gullwing_generator.py SOP, 18 Pin (https://toshiba.semicon-storage.com/info/docget.jsp?did=30523), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-139-02-xx-DV-PE-LC, 39 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 16-Lead Plastic Shrink Small Outline (SS)-5.30 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of TO-92), also known as TO-226, wide, drill 0.75mm (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 5.45mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-4 Horizontal RM 0.97mm Multiwatt-9 staggered type-2 TO-220-7 Horizontal RM 2.54mm IIPAK I2PAK TO-262-5, Vertical, RM 10.9mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-3 Horizontal RM 1.7mm PentawattF- MultiwattF-5 staggered type-2 TO-220-5, Vertical, RM 5.45mm, , see http://www.onsemi.com/pub/Collateral/340AC.PDF TO-3PB-3 Vertical RM 1.27mm Multiwatt-7 staggered type-2 TO-220F-9, Vertical, RM 2.54mm, see http://www.st.com/resource/en/datasheet/stp20nm60.pdf TO-220F-3 Horizontal RM 5.45mm TO-264-5, Horizontal, RM 5.45mm, , see https://toshiba.semicon-storage.com/ap-en/design-support/package/detail.TO-3P(N).html TO-3P-3 Horizontal RM 5.45mm TO-264-3, Vertical, RM 2.54mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-2 Vertical RM 2.54mm TO-220F-3, Vertical, RM 1.27mm, MultiwattF-15, staggered type-1 TO-220F-9 Vertical RM 1.27mm MultiwattF-15 staggered type-1 TO-220-9 Horizontal RM 4.58mm IPAK TO-251-3, Vertical, RM 5.45mm, , see http://www.onsemi.com/pub/Collateral/340AC.PDF TO-3PB-3 Horizontal RM 5.08mm TO-126-2, Vertical, RM 2.54mm, see https://www.njr.com/semicon/PDF/package/TO-220F-4_E.pdf TO-220F-4 Vertical RM 1.27mm staggered.

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