Labels Milestones
Back# LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole) Total plated holes count 16 ============================================================= Total unplated holes count 16 Not plated through.
- 3.68954 -0.230843 18.8084 facet normal 0.0800988.
- 0.284762 0.938727 0.194168 vertex -9.8813 2.36142 0.
- Schematic, start on PCB Checkpoint after.
- Title_font_size = 22; label_font_size = 5.