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Https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=269, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 1x23, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 2x30, 2.54mm pitch, 8.51mm socket length, double rows Surface mounted pin header THT 2x40 1.27mm double row Through hole straight Samtec HPM power header series 3.81mm post length, 1x15, 5.08mm pitch, single row (from Kicad 4.0.7), script generated Through hole pin header THT 2x23 1.00mm double row Through hole IDC header, 2x25, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x04, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header SMD 1x03 2.54mm single row style2 pin1 right Through hole Samtec HPM power header series 3.81mm post length THT 1x13 2.00mm single row (from Kicad 4.0.7), script generated Through hole angled socket strip SMD 1x26 2.00mm single row style1 pin1 left Surface mounted socket strip.

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