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10-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 5-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 1x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils 18-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil Socket LongPads 4-lead though-hole mounted DIP.

U = 44.45; // Horizontal pitch size.
LDR 5.2x5.2, upright, see http://cdn-reichelt.de/documents/datenblatt/A500/M996011A.pdf Resistor.
Vertical Surface Mount Double Row 2.54mm.
4.97 -4.87 (end -1.9 4.87 (end 4.97 4.87.

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