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Back3x4 (perimeter) array, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with pin 2 and 13 removed for voltage dividers feeding chip inputs don't do manual connection to GND if you can have. There aren't a lot of wiring and increases risk of noise on power rails. Latest commits for file caixa_sr1.png Image of caxia score caixa_sr1.png | Bin 12724 -> 0 bytes c58f541d7e Upload files to '3D Printing/Panels/AD&D 1e spell names in Filmoscope Quentin/Panels/MIRROR IMAGE.png' d48d677c91 Delete '3D Printing/AD&D 1e spell names in Filmoscope.
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