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MicroSystems, CB-PSF Package (http://www.allegromicro.com/en/Products/Current-Sensor-ICs/Fifty-To-Two-Hundred-Amp-Integrated-Conductor-Sensor-ICs/ACS758.aspx Allegro Microsystems SIP-4, 1.27mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/A1369-Datasheet.ashx Allegro Microsystems 24-Lead Plastic QFN (2mm x 2mm), http://ams.com/eng/content/download/950231/2267959/483138 DD Package; 14-Lead Plastic Dual Flat, No Lead Package (MF) - 6x5 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 32 leads; body width 5.3 mm; (see NXP sot054_po.pdf TO-92 horizontal, leads molded, narrow, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot369-1_po.pdf SSOP, 16 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T4055-1)), generated with kicad-footprint-generator Molex Mini-Fit Sr. Power Connectors, 42820-22XX, With thermal vias in pads, 5 Pins per row (https://www.molex.com/pdm_docs/sd/022057045_sd.pdf), generated with kicad-footprint-generator connector JST XH series connector, BM14B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On.

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