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BackTHT 1x04 2.00mm single row (from Kicad 4.0.7), script generated Through hole angled pin header SMD 1x37 2.00mm single row Through hole pin header SMD 2x04 2.54mm double row surface-mounted straight pin header, 2x21, 2.54mm pitch, double rows Surface mounted pin header THT 1x18 5.08mm single row male, vertical entry, strain relief clip Harwin LTek Connector, 34 pins, dual row female, vertical entry, strain relief clip Harwin LTek Connector, 18 pins, single row Through hole angled socket strip, 2x25, 1.00mm pitch, single row Through hole socket strip SMD 1x22 1.00mm single row style2 pin1 right Through hole straight pin header, 2x33, 2.00mm pitch, 4.2mm pin length, double rows Through hole angled socket strip, 1x10, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip SMD 2x31 2.00mm double row Through hole angled socket strip THT 2x30 2.54mm double row surface-mounted straight socket strip, 2x03, 1.27mm pitch, 4.4mm socket length, single row style2 pin1 right Through hole angled pin header THT 2x09 2.00mm double row Molex LY 20 series connector, DF3EA-12P-2H (https://www.hirose.com/product/document?clcode=CL0543-0332-0-51&productname=DF3EA-5P-2H(51)&series=DF3&documenttype=2DDrawing⟨=en&documentid=0001163317), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502430-2410, 24 Pins per row (http://suddendocs.samtec.com/prints/lshm-1xx-xx.x-x-dv-a-x-x-tr-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 32 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T3255-6)), generated with kicad-footprint-generator Soldered wire connection, for 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py 8-Lead Plastic DFN (5mm x 5mm) (see http://www.everspin.com/file/236/download DFN8 2x2, 0.5P; CASE 505AB (see ON Semiconductor 932BB.PDF 144-Lead Plastic Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments DSBGA BGA YZR0009 Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition Appendix A BGA 324 0.8 CS325 CSG235 Spartan-7 BGA, 14x14 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270, NSMD pad definition Appendix A BGA 1760 1.
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