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BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition Appendix A BGA 676 1 FF676 FFG676 FFV676 Kintex-7 and Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition.

System, 5268-10A, 10 Pins per row.
{ function get_content($link) { .
-9.838081e+01 9.177800e+01 4.255000e+01 facet normal -8.095803e-001 -3.421870e-003 5.869991e-001.
Normal -4.539842e-001 7.790953e-001 4.323296e-001 facet normal.
SOIC-8, 3.9x4.9mm body, exposed.

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