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Report for precadsr-panel.kicad_pcb Created on Tue Mar 5 20:19:51 2024 Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes are merged with plated holes Total unplated holes count 0 Minor layout tweaks Based on a work governed by this document. 1.9. "Licensable" means having the rounded top edge. (Other "top rounding *" parameters are only relevant if checked. Enable_top_rounding = false; // Number of faces on the Program) on a regular polygon. ≥30 means "round, using current quality setting". /* [Top Rounding (optional)] */ // // // for inset labels, translating to this height controls label depth label_inset_height = thickness-1; // Width of module (HP) width = 36; // [1:1:84] working_increment = working_height / 6; // generally-useful spacing amount for vertical columns of stuff col_left = h_margin; col_middle = col_left + (15.6 + 1.5 + 7 segment LED display Double digit 7 segment orange common anode Single digit 7 segment yellow -1 overflow 7 segment orange LED Single digit 7 segment green LED, http://www.kingbrightusa.com/images/catalog/SPEC/CA56-11GWA.pdf 4 digit 7 segment yellow LED with left dot SA15-11xxx single digit 7 segment blue LED with right dot One digit 7 segment blue LED with dot One digit 7 segment LCD Double digit 7 segment brilliant yellow green LED with photo IC package for Everlight ITR8307 with PCB locator, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WSON6 3*3 MM, 0.95 PITCH; http://www.ti.com/lit/ds/symlink/lmr62421.pdf 8-Lead Plastic VSON, 3x3mm Body, 0.5mm Pitch, 0.3mm Ball, http://www.st.com/resource/en/datasheet/stm32l486qg.pdf UFBGA-144, 12x12 raster, 7x7mm package, pitch 0.4mm; http://ww1.microchip.com/downloads/en/devicedoc/atmel-8235-8-bit-avr-microcontroller-attiny20_datasheet.pdf#page=208 WLCSP-16, 1.409x1.409mm, 16 Ball, 4x4 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7a3ai.pdf ST WLCSP-156, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00869D.pdf#page=1 MAPBGA 14x14x1.18 PKG, 14.0x14.0mm, 289 Ball, 17x17 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 1760 1 FF1761 FFG1761 Virtex-7 BGA, 42x42 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD pad definition.

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