Labels Milestones
BackBGA YFF S-XBGA-N5 Texas Instruments, DSBGA, area grid, YZR pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition Appendix A Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf.
- Normal -0.471711 -0.881672 -0.0119957 facet.
- 9.852583e+01 1.755000e+01 facet normal 5.127229e-14 -1.000000e+00.
- Connector, shielded, PD-30S, http://www.cui.com/product/resource/pd-30s.pdf.
- Pulse KM-4 L_Toroid, Vertical series, Radial, pin pitch=20.10mm.