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BackNLV25, 2.5x2.0x1.8mm, https://product.tdk.com/info/en/catalog/datasheets/inductor_commercial_standard_nlv25-ef_en.pdf tdk nlv25 nlcv25 nlfv25 TDK NLV32, 3.2x2.5x2.2mm, https://product.tdk.com/info/en/catalog/datasheets/inductor_commercial_standard_nlv32-ef_en.pdf tdk nlv32 nlcv32 nlfv32 Inductor, TDK, SLF6028, 6.0mmx6.0mm (Script generated with kicad-footprint-generator Molex CLIK-Mate series connector, B11B-XASK-1-A (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LGA, 14 Pin (JEDEC MO-153 Var DD https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_noLead_generator.py UQFN, 48 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=347), generated with kicad-footprint-generator Hirose DF63 through hole, DF11-22DP-2DSA, 11 Pins (http://www.molex.com/pdm_docs/sd/559350530_sd.pdf), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: A-41792-0011 example for new mpn: 39-29-4229, 11 Pins.
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