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For QRE1113, see https://www.onsemi.com/pub/Collateral/QRE1113-D.PDF OnSemi CASE 100AQ for QRE1113, see https://www.onsemi.com/pub/Collateral/QRE1113-D.PDF OnSemi CASE 100AQ for QRE1113, see https://www.onsemi.com/pub/Collateral/QRE1113-D.PDF OnSemi CASE 100AQ for QRE1113, see https://www.onsemi.com/pub/Collateral/QRE1113-D.PDF OnSemi CASE 100AQ for QRE1113, see https://www.onsemi.com/pub/Collateral/QRE1113-D.PDF OnSemi CASE 100AQ for QRE1113, see https://www.onsemi.com/pub/Collateral/QRE1113-D.PDF OnSemi CASE 100CY, light-direction upwards, see http://www.onsemi.com/pub/Collateral/QRE1113-D.PDF PhotoDiode, plastic DIL, 4.3x4.65mm², RM5.08 PhotoDiode plastic SMD DIL, 4.5x4mm² PhotoDiode plastic DIL RM5.08 PhotoTransistor, sidelooker package, RM2.54 PhotoTransistor sidelooker package RM2.54 package for diode bridges, row spacing 11.48 mm (451 mils 20-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket 40-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 10x-dip-switch SPST KingTek_DSHP10TS, Slide, row spacing 6.15 mm (242 mils), body size 6.7x19.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 4x-dip-switch SPST KingTek_DSHP04TJ, Slide, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 5x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 25.4mm 1000mil Socket 3M 28-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), Socket 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 2x-dip-switch SPST , Slide, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils Analog BGA-28 4.0mm x 6.25mm package, pitch 0.4mm; see section 7.7 of http://www.st.com/resource/en/datasheet/DM00330506.pdf WLCSP-100, 10x10 raster, 10x10mm package, pitch 0.4mm; see section 6.8 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf TFBGA-265, 17x17 raster, 14x14mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f031k6.pdf WLCSP-25, 5x5 raster, 2.133x2.070mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f401vc.pdf WLCSP-49, 7x7 raster, 2.965x2.965mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l151cc.pdf WLCSP-64, 8x8 raster, 4.466x4.395mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00282249.pdf WLCSP-90, 10x9 raster, 4.223x3.969mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UCBGA-81, 9x9 raster, 4.039x3.951mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf TFBGA-100, 10x10, 9x9mm package, pitch 0.35mm; https://datasheets.maximintegrated.com/en/ds/MAX40200.pdf WLP-9, 1.448x1.468mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, ST die ID 483, 3.73x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7a3ai.pdf.

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