3
1
Back

(MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 64-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 20-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 10-lead though-hole mounted DIP package, row.

New Pull Request