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3x3 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf VQFN, 16 Pin (JEDEC MO-153 Var AD https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 4 times 0.75 mm² wires, reinforced insulation, conductor diameter 0.9mm, length 10.0mm, width 3.5mm, e.g. Ettinger 13.13.890, https://katalog.ettinger.de/#p=434 Through hole straight pin header, 2x09.

• 21.59mm width 8.38mm Pulse.
• -6.27889 -0.209414 7.81747 facet normal -0.0366567 0.092425.

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