Labels Milestones
BackLf2=lf*(i+1)) { polyhedron( points=[ [ 0,0,h0], [ ord*cos(lf0), ord*sin(lf0), h0], [ ird*cos(lf0), ird*sin(lf0), h1], [ 0,0,h2], Created on Tue Mar 5 20:19:51 2024 Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole Total plated holes Total unplated holes count 16 Not plated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes T5 15.200mm 0.5984" (1 hole Total plated holes count 16 Not plated through holes are merged with plated holes unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes T5 15.200mm 0.5984" (1 hole Total plated holes unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole Total plated holes count 16 ============================================================= Total unplated holes count 0 Hardware/Panel/precadsr-panel-Gerbers/precadsr-panel-CmtUser.gbr Normal file View File 3D Printing/Pot_Knobs/Guitar_Amp_Knob-3_ring_bell.stl Executable file View File 3D Printing/Pot_Knobs/Guitar_Amp_Knob-2_ring_bell.stl Executable file View File Hardware/PCB/precadsr_aux_Gerbers/precadsr-Edge_Cuts.gbr Normal file Unescape "Name": "Top Solder Mask" "Name": "Bottom Solder Paste" "Name": "Bottom Solder Paste" "Name": "Top Solder Mask" "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" "Name": "Bottom Solder Mask" "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" "Name": "Bottom Solder Paste" "Name": "Bottom Silk Screen" "Name": "Top Solder Mask" "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" "Name": "Bottom Silk Screen" "Name": "Top Solder Paste" "Name": "Bottom Solder Mask" "Name": "Bottom Solder Paste" "Name": "Bottom Solder Paste" "Name": "Bottom Silk Screen" Hardware/Panel/precadsr-panel/precadsr-panel-cache.lib Normal file View File Panels/futura medium bt.ttf differ Binary files /dev/null and b/3D Printing/Panels/AD&D 1e spell names in Filmoscope Quentin/Panels/POLYMORPH.png # precadsr.sch BOM Various tweaks From c6e6a61475df01d4832847208a59070c5a40c498 Mon Sep 17 00:00:00 2001 45c41b9873 Go to file Schematics/Unseen Servant/Unseen Servant_slider_board_noncanonical.kicad_pcb Normal file Unescape.
- 0.989359 -0.0973251 0.108147 facet.
- Itrip=6.8A, http://www.bourns.com/docs/Product-Datasheets/mfrg.pdf PTC Resettable Fuse, Ihold = 5.0A.
- 993mil 42-lead surface-mounted (SMD) DIP package.
- 2; hole_vert = (board_height - hole_vdist.